Call for Papers

We invite submissions of high-quality research contributions that address technological advancements, theoretical frameworks, design methodologies, and real-world applications of AI, IoT, and Smart Systems. Topics include but are not limited to:

Topical Areas:

Internet of Things (IoT) & AIoT

Artificial Intelligence & Machine Learning

Blockchain & Distributed Ledger Technologies

Cloud & Edge Computing

Cybersecurity, Privacy & Trust

Low-Power Design & Embedded AI

Generative AI & Emerging Intelligent Systems

Industry & Vertical Applications:

Smart Cities, Infrastructure & Transportation

Digital Healthcare & Well-Being

Industry 4.0 & Smart Manufacturing

Energy Systems & Smart Grids

Sustainable AI & Green Computing

IEEE DataPort

Call for Papers: IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025)

4 - 6 August 2025 | Madison, Wisconsin, USA

Abstract Submission Deadline: 1 April 2025
Full Paper Submission Deadline: 8 April 2025
Acceptance Notification: 31 May 2025
Camera-Ready Submission: 21 June 2025

Conference date: 4-6 August 2025

IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025) The IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025) invites submissions for original research, technical papers, and proposals on AI and Smart Systems. IEEE COINS serves as a global forum for academic and industry leaders to discuss the latest advancements in digital transformation and intelligent systems. IEEE COINS 2025 will be held at the University of Wisconsin–Madison, USA, offering a vibrant and collaborative environment to explore cutting-edge research and technological innovations. Conference Website CFP Details

Call for Papers

Internet of Things (IoT) & AIoT
Artificial Intelligence & Machine Learning
Blockchain & Distributed Ledger Technologies
Cloud & Edge Computing
Cybersecurity, Privacy & Trust
Low-Power Design & Embedded AI
Generative AI & Emerging Intelligent Systems

Industry & Vertical Applications:

Smart Cities, Infrastructure & Transportation
Digital Healthcare & Well-Being
Industry 4.0 & Smart Manufacturing
Energy Systems & Smart Grids
Sustainable AI & Green Computing

In addition to submitting your paper to IEEE COINS 2025, you are also encouraged to upload the data related to your paper to IEEE DataPort. IEEE DataPort is IEEE's data platform that supports the storage and publishing of datasets while also providing access to thousands of research datasets. Uploading your dataset to IEEE DataPort will strengthen your paper and will support research reproducibility. Your paper and the dataset can be linked, providing a good opportunity for you to increase the number of citations you receive. Data can be uploaded to IEEE DataPort prior to submitting your paper or concurrent with the paper submission. Thank you!

Call for Special Sessions, Workshops & Tutorials

We also welcome proposals for:

Workshops – Focused discussions on emerging topics.
Tutorials – Expert-led sessions for in-depth learning.
Special Sessions – In-depth treatment of trending themes.
Panel Discussions – Engaging conversations with industry leaders.

Why Participate?

Present your research to an international audience.
Network with global experts from academia and industry.
Get published in IEEE Xplore.
Engage in cutting-edge discussions on AI, IoT, and Smart Systems.

Sponsored By

IEEE COINS 2025 is proudly supported by:

IEEE Computer Society
IEEE Robotics and Automation Society
IEEE Council on Electronic Design Automation (CEDA)
IEEE Region 4

Join us in shaping the future of intelligent systems. Submit Your Paper Now: IEEE COINS 2025 Submission. We welcome you to the University of Wisconsin–Madison for IEEE COINS 2025.